Intel announced IDM 2.0 in March 2021; its annual report, filed this month, is where that announcement becomes a defined strategy in the formal record. The 10-K describes IDM 2.0 as the next evolution of Intel's integrated-device-manufacturer model - and the definition has parts worth separating.
The filing is the FY2021 Form 10-K (sec.gov; accession 0000050863-22-000007). It states that IDM 2.0 combines Intel's internal factory network, the strategic use of foundry capacity, and the provision of foundry services to others. Three capabilities, one strategy.
The first capability - the internal factory network - is the classic Intel: design and build your own chips in your own fabs. The second - strategic use of outside foundry capacity - means Intel will have some products manufactured by other foundries when that serves it. The third - foundry services to others - means Intel intends to manufacture chips designed by external customers.
Holding the three apart matters because they pull in different directions and carry different risks. Using outside foundries is an admission that internal capacity or process leadership has gaps to fill; offering foundry services is a bet that Intel can win trust and volume from customers who are often also competitors. The annual report commits to both simultaneously.
For an explainer reader, the value of the 10-K definition is precision. 'Turnaround' is a narrative; 'internal factories plus external foundry use plus foundry-for-others' is a testable structure. Future filings can be measured against each of the three legs.
The primary record is the sec.gov 10-K; it was surfaced via EdgarBeast, an SEC-filing evidence index. When a strategy gets a brand name, the antidote to hype is the filing's own definition - which here breaks IDM 2.0 cleanly into three.